Expanded offerings of OCP NIC 3.0 cards enable high-performance,
high-efficiency server systems driving next generation computing
and storage applications
Broadcom Inc. (NASDAQ: AVGO) today announced customer sample
availability of its OCP NIC 3.0 adapter solutions supporting the
full range of data rates and interfaces from 1GbE to 200GbE. The
portfolio includes a wide selection of Ethernet adapter cards with
1-, 2- and 4-port configurations, allowing the industry to easily
build high-performance server systems and effectively scale network
capacity to meet the demands of high bandwidth applications such as
machine learning, high performance computing (HPC), network
function virtualization (NFV), and all flash arrays (AFA).
Based on proven NetXtreme® E-Series Ethernet controllers, the
OCP NIC 3.0 adapters provide superior performance and efficiency
utilizing a unique set of highly optimized hardware acceleration
engines. 100GbE and 200GbE adapters are powered by Broadcom’s
state-of-the-art Thor multi-host controller that has the industry’s
best performing 56G PAM-4 SerDes and PCIe 4.0 interface. Broadcom
offers the most advanced and complete portfolio of OCP NIC 3.0
adapters, enabling data center operators and cloud providers to
easily and cost-effectively scale computing and storage resources
and adapt to constantly changing requirements.
“OCP NIC 3.0 provides a unified specification and form factor
for connecting server and storage systems,” said Ed Redmond, senior
vice president and general manager of the Compute and Connectivity
Division at Broadcom. “With strong customer demand and virtually
unanimous industry backing for this unified solution, our complete
portfolio of OCP NIC 3.0 adapters facilitates broad adoption of
this new form factor and drives further innovation in high
performance computing and storage applications to address an
ever-increasing demand for bandwidth.”
“The availability of Broadcom’s NetXtreme E-Series Ethernet OCP
NIC 3.0 adapters is another important step in enabling customer
deployments of the demanding networking solutions required by
current and future data center applications and architectures in an
open, scalable and economical way,” said Seamus Crehan, president
of Crehan Research. “Furthermore, Broadcom’s comprehensive OCP NIC
3.0 adapter offerings, which includes an extensive range of
networking speeds and port configurations, brings the latest OCP
value propositions to a wide array of diverse
customers.”
Demo Showcase at 2019 OCP Global Summit
Broadcom will participate in the OCP Community exhibition area
and showcase the latest high performance Thor-based OCP NIC 3.0
adapter in a live end-to-end network connectivity demo with
Broadcom® Tomahawk®-based ToR switch. Broadcom OCP NIC 3.0 adapters
will also be demonstrated in various server systems at partner
booths.
Availability
Broadcom is now sampling the entire portfolio of OCP NIC 3.0
adapters to qualified customers, supporting 1G to 200G Ethernet
speeds. Please contact your local Broadcom sales
representative for samples and pricing.
Further information on Broadcom’s OCP NIC 3.0 adapters
can be found online at:
200GbE Network Adapters100GbE Network Adapters40/50GbE Network
Adapters25GbE Network Adapters10GbE Network Adapters1GbE Network
Adapters
Quotes
“We are pleased with a broad solution offering based on the new
OCP NIC 3.0 spec,” said Jia Ning, hardware engineering manager at
Facebook. “Variety of offerings around a common standard will
facilitate broad adoption that will fill end customer needs for
diverse server designs.”
“We are pleased to see a complete portfolio of network adapters
from Broadcom,” said Ying Liu, VP of Tencent Cloud. “Support for
the full speeds and feeds as well as 50G PAM4 Serdes and 200G on
one form factor allows us to use more cost effective and flexible
server solutions.”
“The OCP NIC 3.0 definition is just one example of the power of
collaboration to establish open server platforms in the industry,
and we welcome the availability of the new Broadcom OCP NIC 3.0
solutions to the ecosystem,” said Raghu Nambiar, corporate vice
president and CTO of the Datacenter Ecosystems & Application
Engineering at AMD. “With the first PCIe 4.0 products from AMD
expected to arrive this year, the ability to support the highest
speed NICs from Broadcom in an OCP design will be welcomed by
customers of AMD EPYC processors.”
“New demands for open systems standards emerge each day to
modernize the data center, and as a platinum partner of the Open
Compute Project (OCP), we are committed to supporting and
accelerating innovation to meet those growing needs,” said Tom
Lattin, vice president of ProLiant and Cloudline Systems at Hewlett
Packard Enterprise. “With HPE’s contributions, along with
Broadcom’s, to the OCP 3.0 specification, we are building on a long
history of advancing open standards to drive innovation for the
data center with a common networking hardware definition.”
“Inspur is the 3rd largest server provider in the world and No.1
in China. We continue to lead with high end server designs
addressing cloud providers fast evolving requirements,” said Peter
Peng, vice president of Inspur Group. “Broadcom's new complete
portfolio of OCP NIC 3.0 Ethernet adapters will allow us to offer
high-performance and cost-effective server solutions to our broad
range of customers in China and around the world.”
“Quanta/QCT have been spearheading OCP innovations for the past
decade and is a leading adopter of the new OCP NIC 3.0 standard,”
said Mike Yang, senior vice president of Quanta Computer Inc. and
president of Quanta Cloud Technology (QCT). “We plan to take
advantage of Broadcom’s portfolio of OCP NIC 3.0 Ethernet adapters
to offer our customers a complete Ethernet connectivity solution
based on the high performance NetXtreme E-series product line.”
“H3C’s new UniServer R5300G3 server integrated many innovations
to meet the strong demand of Chinese customers for the cutting-edge
technology,” said Billy Chen, vice president of the new H3C Group
and president of the Compute & Storage product line.
“Broadcom’s new OCP NIC 3.0 portfolio of Ethernet adapters from 1G
to 200G addresses the full range of speeds and feeds our broad
customer base requires.”
“Wiwynn is pleased to work with our long-term partner—Broadcom
to develop the new OCP NIC 3.0 solutions to enable high performance
Ethernet connectivity in next-generation data centers,” said Steven
Lu, vice president of product management at Wiwynn. “Broadcom is
the industry leading supplier that can offer an advanced and
complete portfolio of Ethernet connectivity solutions based on the
new standard.”
“GIGABYTE continues to improve our server performance by
optimizing design from generation to generation. The new OCP 3.0
specification helps us achieve higher Thermal Design Power (TDP)
limitations, simplifies FRU installation and removal, and
implements PCIe Gen 4.0 (16 GT/s). OCP 3.0 will be a key feature of
GIGABYTE’s next generation server architecture. Thanks to
Broadcom’s full line up of OCP3.0 NICs, we can provide a wide
selection of products to fulfill different demands from our
customers. We are planning to launch our AMD EPYC™ Processor
products qualified with Broadcom OCP3.0 NICs as our first OCP 3.0
product wave,” said Akira Hoshino, head of Product Strategy and
Planning at GIGABYTE.
“Inventec is a leading adopter of the new OCP NIC 3.0 standard,”
said George Lin, general manager of BU-6 at Inventec. “We plan to
take full advantage of Broadcom’s portfolio of OCP NIC 3.0 Ethernet
adapters to offer our customers the complete Ethernet connectivity
solution based on the high performance NetXtreme E-series product
line.”
“MiTAC server reserves the flexibility to support OCP NIC cards.
Broadcom's NIC solution is in MiTAC product POR in order to support
generation to generation OCP, such as V0.5, V2.0, and OCP NIC3.0.
Supporting OCP NIC 3.0 allows us to take advantage of better
performance and reliability,” said Simon Hwang, vice president of
Enterprise Business Unit at MiTAC Computing Technology Corp.
“In my role as the HPC representative on the OCP Incubation
Committee and as part of a company that supports a wide variety of
OCP-based high-performance computing and artificial intelligence
designs, I’m really excited at the improvement to serviceability
and lower total cost of ownership this new Broadcom OCP NIC 3.0
portfolio will give customers,” said Phil Pokorny, chief technology
officer of Penguin Computing. “As the volume of data -- and the
potential value that customers can extract from it -- continues to
increase, standards like OCP NIC 3.0 will become critical to
successful scale out. Broadcom technologies like this are exactly
what customers need to meet the wide variety of modern computing
needs.”
“The Open Compute Project Spec 3.0 designs will help enable high
performance server, storage and data center for scalable
computing,” said Weishi Sa, president of ASRock Rack. “ASRock
Rack’s latest OCP 3.0-compliant cloud computing servers and
Broadcom’s best-in-class Ethernet adapter cards are ready to meet
customer demand to achieve cost savings and energy efficiency.”
About Broadcom Broadcom Inc. (NASDAQ:
AVGO) is a global technology leader that designs, develops and
supplies a broad range of semiconductor and infrastructure software
solutions. Broadcom’s category-leading product portfolio serves
critical markets including data center, networking, enterprise
software, broadband, wireless, storage and industrial. Our
solutions include data center networking and storage, enterprise
and mainframe software focused on automation, monitoring and
security, smartphone components, telecoms and factory automation.
For more information, go to www.broadcom.com.
Broadcom, the pulse logo, Connecting everything, Tomahawk and
NetXtreme are among the trademarks of Broadcom. The term
"Broadcom" refers to Broadcom Inc., and/or its subsidiaries.
Other trademarks are the property of their respective owners.
Press Contact:Khanh LamCorporate
Communicationspress.relations@broadcom.comTelephone: +1 408 433
8649
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