Broadcom’s Leading Networking, Compute and Storage Technologies Support a Broad Set of OCP Initiatives
14 Mars 2019 - 6:05PM
Deep Collaboration with Industry Leaders
Accelerates Innovation in Cloud Data Centers
Broadcom Inc. (NASDAQ: AVGO) today announced its commitment to open
computing at the 2019 Open Compute Project (OCP) Global Summit
being held March 14 – 15 at the San Jose Convention Center. A
long-time supporter of open, standards-based technology, Broadcom
is committed to developing high performance, scalable solutions
optimized for today’s hyperscale data centers. Broadcom is a
leading provider of OCP-compliant solutions, either directly
through design project contributions or indirectly, via ODM and OEM
integrations; in fact, roughly seven out of ten OCP networking
hardware and storage contributions incorporate Broadcom
technologies.
Broadcom’s technologies are specifically designed to deliver
maximum performance and bandwidth while providing energy and cost
efficiencies and Broadcom switches, network adapters and storage
connectivity solutions are featured in a broad range of OCP
architectures and designs. Notable OCP projects involving
Broadcom’s technologies include:
- A collaborative project with Facebook to build a community for
hardware-accelerated infrastructure in areas such as video
delivery
- A collaboration with Microsoft to enable the OCP community with
RTL models for data compression acceleration
- Facebook’s 128x100 GbE Minipack platform built on Broadcom’s
Tomahawk® 3 Ethernet Switch
- A collaborative industry project for developing the third
generation OCP NIC standard (OCP NIC 3.0) to enhance server
networking I/O bandwidth with expanded provisions for thermal
footprints.
“Broadcom is proud to be a leader in this vibrant OCP community
through the delivery of industry-first networking, storage and
compute solutions that support high-performance cloud data
centers,” said Charlie Kawwas, Ph.D., Senior Vice President and
Chief Sales Officer at Broadcom. “As IT technology continues to
evolve toward a cloud-based, application-driven ecosystem, the
introduction of new innovations, such as the industry’s first
12.8Tbps switch, OCP NIC 3.0 and end-to-end PCIe Gen 4 solutions,
will benefit the cloud ecosystem and, ultimately, end users.”
Broadcom will be showcasing its innovations and participating in
multiple technical panel sessions and partner booth demonstrations
at the OCP Global Summit, specifically:
- A live end-to-end network connectivity demo featuring
Broadcom’s new Thor OCP NIC 3.0 adapter with the Tomahawk
top-of-rack switch in the OCP Community Demo area
- A disaggregated chassis SONiC network supporting multiple
features such as IPv4/IPv6 routing and VXLAN using individual
Jericho2 and Tomahawk 3 platforms connected in a CLOS topology in
the Microsoft booth (#A6)
- A new telemetry SAI TAM 2.0 over SONiC and QCT’s Trident 3
platform to showcase next generation, advanced analytic services
using Inband flow analyzer (IFA) in the Microsoft booth (#A6)
- In collaboration with Seagate and other ODM partners,
Broadcom’s SAS35 series Expanders and 9400 Tri-mode Storage HBAs
will be shown in a performance demonstration of
Seagate’s MACH.2™ dual actuator drives in Microsoft’s
newly-released S2010 storage system in the ZT Systems booth
(#A17)
- An OCP platform demonstration in the Wiwynn booth (#A12)
featuring the SV7000, ST7000, SV500, and SV7400, XC200 and HGX2
systems, powered by Broadcom storage and PCIe Gen 3/4 switch
technology
- A JBOF platform demonstration in the Mitac booth (#D2)
featuring the Mitac FR2223, powered by Broadcom’s PCIe
Gen 4 Switch technology
- Eli Karpilovski, Director of Product Marketing, will be
speaking on the topic of “Advanced Network Telemetry and Analytics
Over SONiC,” on Friday, March 15 at 9 a.m. PT
- Hemal Shah, Distinguished Engineer and Architect, will be
speaking at the following sessions on Friday, March 15:
- “OCP Profiles for Hardware Management” at 8 a.m. PT
- “OCP NIC Thermal Test Standardization and Demo (Server WG)” at
1:30 p.m. PT
- “PCMI Standards for Hardware Management” at 2:30 p.m. PT
- Long Nguyen, Master Hardware Engineer, and Hemal Shah will be
speaking in a session called, “OCP NIC 3.0 Design and
Implementation Experiences” on Friday, March 15 at 9 a.m. PT
About BroadcomBroadcom Inc. (NASDAQ: AVGO)
is a global technology leader that designs, develops and supplies a
broad range of semiconductor and infrastructure software solutions.
Broadcom’s category-leading product portfolio serves critical
markets including data center, networking, enterprise software,
broadband, wireless, storage and industrial. Our solutions include
data center networking and storage, enterprise and mainframe
software focused on automation, monitoring and security, smartphone
components, telecoms and factory automation. For more information,
go to www.broadcom.com.
Broadcom, the pulse logo, Connecting everything, and Tomahawk
are among the trademarks of Broadcom. The term "Broadcom"
refers to Broadcom Inc., and/or its subsidiaries. Other
trademarks are the property of their respective owners.
Press Contact: Jennifer MiuCorporate
Communicationspress.relations@broadcom.comTelephone: +1
408-433-7848
Broadcom (NASDAQ:AVGO)
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