Soitec on track to enlarge Silicon Carbide product portfolio with first 200mm SmartSiCTM engineered substrate
04 Mai 2022 - 8:30AM
Soitec on track to enlarge Silicon Carbide product portfolio with
first 200mm SmartSiCTM engineered substrate
Soitec on track to enlarge Silicon Carbide
product portfolio with first 200mm
SmartSiCTM engineered
substrate
Based on its unique and patented SmartSiC™
technology, Soitec’s new silicon carbide
(SiC) substrates are designed to improve the
performances of power electronics devices and boost electric
vehicles’ energy efficiency
Bernin (Grenoble), France, May
4th, 2022 — Soitec
(Euronext Paris), an industry leader in designing and manufacturing
innovative semiconductor materials, has released its first 200mm
silicon carbide SmartSiC™ wafer. With the release, Soitec is
able to enlarge its SiC product portfolio beyond 150mm, take the
development of its SmartSiC™ wafers to the next level and
cater to the growing demand of the automotive market.
The SmartSiC™ substrate in 200mm
emerged from Soitec’s pilot line at its Substrate Innovation
Center within CEA-Leti in Grenoble. The release enabled Soitec
to demonstrate the quality and performance of a 200mm SmartSiC
wafer and conduct a first round of key customer validations.
Soitec launched the construction of a
new fab in France, Bernin 4, in March 2022. It is primarily
dedicated to the manufacturing of SmartSiC™ wafers in 150mm and
200mm and is expected to be operational by the
second half of 2023.
Soitec’s unique SmartSiC™ technology allows
to significantly enhance the performance of power electronics
devices and boost electric vehicles’ energy efficiency. The
technology consists in bonding a very thin layer of high quality
SiC to a very low resistivity polySiC wafer.
“Soitec’s SmartSiC™ substrates will be key for
energy-efficient
electromobility,” says Christophe Maleville,
Chief Technology Officer of Soitec. “Our unique
technology allows us to pioneer cutting-edge engineered substrates
and open up new perspectives for power electronics in the
automotive and industrials markets. The addition of 200mm
to our SiC substrate
family allows us to further differentiate our portfolio
and address an even larger variety of customer requirements,
in terms of product quality, reliability, volume, and energy
efficiency. The release of a 200mm SmartSiC™ wafer is an important
milestone in the development and deployment of our SmartSiC™
technology. It underpins our technological leadership, our
capability to drive innovation and launch next generation wafer
technologies.”
About Soitec
Soitec (Euronext, Tech 40 Paris) is a world leader
in designing and manufacturing innovative semiconductor materials.
The company uses its unique technologies and semiconductor
expertise to serve the electronics markets. With more than 3,500
patents worldwide, Soitec’s strategy is based on disruptive
innovation to answer its customers’ needs for high performance,
energy efficiency and cost competitiveness. Soitec has
manufacturing facilities, R&D centers and offices in Europe,
the U.S. and Asia. Fully committed to sustainable
development, Soitec adopted in 2021 its corporate purpose to
reflect its engagements: "We are the innovative soil from which
smart and energy efficient electronics grow into amazing and
sustainable life experiences. »
Soitec, SmartSiC™ and SmartCut™ are registered
trademarks of Soitec.
For more information, please
visit www.soitec.com and
follow us on Twitter:
@Soitec_EN.
For more information, please
contact:
Investor relations: |
Media contacts: |
investors@soitec.com |
Markus Payer+33 7 85 54 90
84markus.payer-ext@soitec.com |
# # #
Soitec is a French joint-stock corporation with
a Board of Directors (Société Anonyme à Conseil d’administration)
with a share capital of €70,301,160.00, having its registered
office located at Parc Technologique des Fontaines - Chemin des
Franques - 38190 Bernin (France), and registered with the Grenoble
Trade and Companies Register under number 384 711 909.
# # #
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