The
information contained within this announcement was deemed by the
Company to constitute inside information as stipulated under the UK
Market Abuse Regulation.
24 March 2025
EnSilica
plc
("EnSilica", the "Company" or the "Group")
EnSilica Agrees a
Multimillion Pound Design and Manufacturing Services
Contract
Increased demand leads to
second design centre in Brazil
EnSilica plc (AIM:ENSI), a leading
chip maker of mixed signal ASICs ("Application Specific Integrated
Circuits"), is pleased to announce that it has been awarded a
multimillion-pound design and manufacturing services contract by a
well-funded pioneering optical computing systems company (the
"Contract").
The Contract includes substantial
design services engagement and additional manufacturing services.
Following the completion of an initial study phase, activity will
now increase significantly, with revenues contributing to
EnSilica's current and the following two financial
years.
This addition to EnSilica's
offerings stems from strengthened relationships with key wafer
foundry and semiconductor supply chain partners. This now allows
EnSilica to provide wafers, packages, and tested devices along with
design services. This model, successfully executed by several Asian
companies including Socionext, Alchip, and Global Uni Chip (GUC),
is now being leveraged by the Company to meet the growing demand
for a resilient European-based supply chain.
Finally, and due to increased
demand, EnSilica has opened a second design centre in Campinas, São
Paulo State, Brazil. This location, with its strong semiconductor
ecosystem, has enabled the rapid growth of EnSilica's existing
engineering team in the region.
Ian
Lankshear, CEO of EnSilica, commented:
"We are pleased to secure this sizable contract with a
pioneering optical computing systems company. This agreement not
only underscores our capabilities in delivering comprehensive
design and manufacturing services but also highlights the growing
demand for European-based supply chains.
Our strengthened relationships with key wafer foundry and
semiconductor supply chain partners enable us to provide
high-quality wafers, packages, and completed tested
devices.
We
are also delighted to be opening our second design centre in
Brazil, which further underscores our strategic ambitions to expand
our global footprint in order to meet the increasing demand for our
services."
For
further information please contact:
|
EnSilica plc
Ian Lankshear, Chief Executive
Officer
Kristoff Rademan, Chief Financial
Officer
www.ensilica.com
|
via Vigo Consulting
+44 (0)20 7390 0233
|
|
Allenby Capital Limited, Nominated Adviser & Joint
Broker
Jeremy Porter / Vivek Bhardwaj
(Corporate Finance)
Joscelin Pinnington / Tony Quirke
(Sales & Corporate Broking)
|
+44 (0)20 3328 5656
info@allenbycapital.com
|
|
Singer Capital Markets, Joint Broker
Rick Thompson / Asha
Chotai
|
+44 (0)20 7496 3000
|
|
Vigo Consulting (Investor & Financial Public
Relations)
Jeremy Garcia / Kendall Hill / Anna
Stacey
|
+44 (0)20 7390 0233
ensilica@vigoconsulting.com
|
The person responsible for arranging release of this
announcement on behalf of the Company is Ian Lankshear, Chief
Executive Officer.
About EnSilica plc
EnSilica is a leading fabless design
house focused on custom ASIC design and supply for OEMs and system
houses, as well as IC design services for companies with their own
design teams. The company has world-class expertise in supplying
custom RF, mmWave, mixed signal and digital ICs to its
international customers in the automotive, industrial, healthcare
and communications markets. EnSilica has a track record in
delivering high quality solutions to demanding industry standards.
The company is headquartered near Oxford, UK and has design centres
across the UK and in Bangalore, India and Porto Alegre and
Campinas, Brazil.
