Media Alert: Rambus Presenting Sessions on Shaping the Next-Generation Data Center at DesignCon
29 Janvier 2024 - 11:00PM
Business Wire
Rambus Inc.
What:
DesignCon 2024
Who:
Rambus Inc. (Nasdaq: RMBS), a premier chip
and silicon IP provider
Where:
Santa Clara Convention Center
Room: Great America 1
5001 Great America Pkwy
Santa Clara, CA 95054
When:
January 31, 2024. The first session begins
at 8:00 a.m. PT
At DesignCon, technology experts from Rambus will be conducting
a series of presentations on Wednesday, January 31. These will
cover the selection and implementation of IP solutions for the data
center, 5G/edge and IoT applications, including emerging
technologies like DDR5, HBM3E, PCIe 6.1 and CXL 3.1 interfaces,
quantum safe cryptography and VESA display stream compression.
Hear Steven Woo, fellow and distinguished inventor at Rambus,
discuss, "Memory Systems for AI in the Data Center," exploring
technologies that will power next-generation computing, including
sophisticated Large Language Models (LLMs) and generative AI. Lou
Ternullo, senior director of product marketing at Rambus, will
investigate “How PCIe 6.1 and CXL 3.1 Interfaces Will Enable
Next-Generation Data Centers” – or drop in on his later
presentation diving into, “Meeting the Needs of AI Training with
HBM3E.”
Carlos Weissenberg, senior product marketing manager at Rambus,
will be discussing how DDR5 will scale to advanced performance
levels, be deployed in new applications beyond RDIMMs, and how it
is tailored for client computing systems in his presentation,
“What’s Next for DDR5 Memory?” Rambus will also discuss how
applications like generative AI are pushing current data center
infrastructure to the limit with the presentation titled, “CXL
Technology: Revolutionizing the Data Center” from Zaman Mollah, SPE
Applications Engineering.
On the quantum security front, hear Rambus senior technical
director, Scott Best, discuss recent developments in Quantum Safe
Cryptography and what you need to know to protect devices in the
quantum computing era.
And attend a discussion of “VESA Display Stream Compression
(DSC) & FEC for DisplayPort Interfaces,” by Johnny Kim, senior
field applications engineer at Rambus, reviewing how you can use
VESA DSC combined with FEC to deliver cutting-edge displays.
To find out more about the Rambus training sessions being
presented at DesignCon, visit https://www.rambus.com/designcon/.
For more details on our latest Rambus memory interface chips,
high-performance interface IP, as well as security IP solutions,
visit rambus.com.
Follow Rambus: Company website: rambus.com Rambus blog:
rambus.com/blog Twitter: @rambusinc LinkedIn:
www.linkedin.com/company/rambus Facebook:
www.facebook.com/RambusInc
About Rambus Inc.
Rambus is a provider of industry-leading chips and silicon IP
making data faster and safer. With over 30 years of advanced
semiconductor experience, we are a pioneer in high-performance
memory subsystems that solve the bottleneck between memory and
processing for data-intensive systems. Whether in the cloud, at the
edge or in your hand, real-time and immersive applications depend
on data throughput and integrity. Rambus products and innovations
deliver the increased bandwidth, capacity and security required to
meet the world’s data needs and drive ever-greater end-user
experiences. For more information, visit rambus.com.
Source: Rambus Inc.
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version on businesswire.com: https://www.businesswire.com/news/home/20240129879367/en/
Press Contact: Cori Pasinetti Rambus Corporate
Communications t: (650) 309-6226 cpasinetti@rambus.com
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