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Ibm S''Interesse Stmi = Bien Accueilli !

- 20/9/2010 16:40
djurjura Messages postés: 835 - Membre depuis: 21/2/2008

IBM, Samsung and GLOBALFOUNDRIES Set for Fab Synchronization to Produce Advanced Chips Based on 28nm Process Technology with STMicroelectronics Tab navigationPress releaseRelated XML feedsContact(s) information. -------------------------------------------------------------------------------- EAST FISHKILL - 23 Jun 2010: IBM(IBM), Samsung Electronics, Co., Ltd., GLOBALFOUNDRIES and STMicroelectronics said today that the four companies are collaborating to synchronize semiconductor manufacturing facilities for the production of advanced chips based on 28nm process jointly developed by IBM Technology Alliance. The synchronization process helps ensure that customers' chip designs can be produced at multiple sources in three different continents with no redesign required. The technology alliance, based at IBM's facility in East Fishkill, New York, includes GLOBALFOUNDRIES, IBM, Infineon Technologies, Renesas Electronics, Samsung Electronics, STMicroelectronics and Toshiba. IBM, Samsung and GLOBALFOUNDRIES -- members of the Common Platform alliance -- are working with STMicroelectronics to develop and standardize advanced, 28nm process technology to ensure consistent production worldwide for electronics and device manufacturers. The low-power, 28nm process technology is designed for the next generation of smart mobile devices, enabling designs with faster processing speeds, smaller feature sizes, low standby power and longer battery life. The 28nm process technology is slated to become the foundation for a new generation of portable electronics that are capable of handling streaming video, data, voice, social networking and mobile commerce applications. The 28-nanometer chips will use bulk complementary metal oxide semiconductor (CMOS), and high-k metal gate (HKMG) processes. Members of the alliance are driving the global standard for HKMG with their unique "Gate First" technology. The approach is superior to other HKMG solutions in both scalability and manufacturability, offering a smaller die size and compatibility with design elements and process flows from previous technology nodes. "IBM has extensive experience synchronizing multiple fabs, where we match rigorous manufacturing specifications to critical design parameters," said Gary Patton, vice president for IBM's Semiconductor Research and Development Center. "The result is that our advanced technology can be implemented in many fabs around the world and produce the same results, providing clients with multiple suppliers for their product designs." "Samsung has done extensive fab synchronization work with Chartered and IBM in the past and welcomes the expansion of this activity with GLOBALFOUNDRIES and STMicroelectronics at 28nm. We expect our customers will gain significant benefits in accelerated time to volume production and assurance of supply from the synergy of this collaboration," said Jay Min, vice president, Samsung Electronics' Foundry business. "Today's announcement is further proof of the importance of collaboration to enabling advanced technology foundry innovation," said Suresh Venkatesan, vice president of alliance technology development at GLOBALFOUNDRIES. "Along with our partners in the Common Platform alliance, we are committed to delivering to customers a robust 28nm technology implementation that breaks new ground in performance and power efficiency. By collaborating to align production capabilities we provide customers with maximum flexibility in foundry selection at the leading edge." The members of the Common Platform alliance and STMicroelectronics will optimize the processes and tooling at all the respective manufacturing lines, or fabs, to ensure the chip designs can be produced with the same functional and electrical results at each of the companies. "ST's work with the Common Platform alliance continues our longstanding tradition of partnering with leaders for the benefit of our customers and the development of the 28nm low-power technology is yet another success," said Joel Hartmann, Technology R&D Group VP and General Manager Advanced CMOS, Derivatives and eNVM technology, STMicroelectronics. "We are working to make this technology available to our customers for portable, consumer, computer-peripheral and other applications as soon as possible and will extend its capabilities through the use of application-specific CMOS-derivative technologies."



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1 de 1 - 19/4/2016 19:08
Pauline75 Messages postés: 2620 - Membre depuis: 10/9/2013
Le titre IBM chute de 5% actuellement en à Wall Street, à 144,3$, alors que le géant américain des services technologiques a publié hier soir ses résultats du premier trimestre. Les bénéfices sont de 2,01 Mds$ (2,09$ par action), contre 2,33 Mds$ (2,35$ par action) un avant. Le bpa ajusté ressort à 2,35$, contre 2,91$ il y a un an. Les revenus s'élèvent à 18,68 Mds$, contre 19,59 Mds$ sur la même période de l'exercice précédent.

Les analystes anticipaient en moyenne un bénéfice par action de 2,09$, pour des revenus de 18,3 Mds$.

IBM vise toujours, pour l'exercice 2016, un bénéfice d'exploitation par action d'au moins 13,5$.
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