ASAT Holdings Limited Appoints Peter Tin as Senior Vice President of Quality and Reliability Assurance
02 Août 2007 - 3:00PM
PR Newswire (US)
MILPITAS, Calif. and HONG KONG, Aug. 2 /PRNewswire-FirstCall/ --
ASAT Holdings Limited (NASDAQ:ASTT), a global provider of
semiconductor package design, assembly and test services, today
announced the appointment of Peter Tin as senior vice president of
quality and reliability assurance, replacing Ed Bedell who resigned
to pursue other opportunities. (Logo:
http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO) Mr. Tin
previously served as ASAT's vice president of quality from 2004 to
2005 prior to ASAT moving its manufacturing to China. During this
time he was responsible for setting up the quality systems at ASAT
China and instrumental in maintaining quality systems control
during the transition. "We are pleased Peter has rejoined ASAT and
look forward to his leadership in the quality control area as we
develop our operations in China," said Tung Lok Li, acting chief
executive officer of ASAT Holdings Limited. Over the span of his
more than 20 year career, Mr. Tin has held engineering, supplier
management, reliability and quality positions in semiconductor,
consumer electronics and transportation industries in the United
States and Greater China. He most recently was a member of the
management team of Philips Consumer Electronics in the Business
Groups of Mobile Infotainment and Mobile Phones based in Hong Kong.
Mr. Tin has also held various quality and reliability management
positions with SanDisk, Western Digital, Bombardier Transportation,
and National Semiconductor. Mr. Tin holds a master's of science
degree in reliability engineering, and separate bachelor's of
science degrees in aerospace and mechanical engineering from the
University of Arizona. Mr. Tin is a Six Sigma blackbelt and is also
a Certified Reliability Engineer and Certified Quality Engineer by
the American Society for Quality. About ASAT Holdings Limited ASAT
Holdings Limited is a global provider of semiconductor package
design, assembly and test services. With 18 years of experience,
the Company offers a definitive selection of semiconductor packages
and world-class manufacturing lines. ASAT's advanced package
portfolio includes standard and high thermal performance ball grid
arrays, leadless plastic chip carriers, thin array plastic
packages, system-in-package and flip chip. ASAT was the first
company to develop moisture sensitive level one capability on
standard leaded products. Today the Company has operations in the
United States, Asia and Europe. For more information, visit
http://www.asat.com/. Safe Harbor This press release may contain
statements of a forward-looking nature. These statements are made
under the "safe harbor" provisions of the U.S. Private Securities
Litigation Reform Act of 1995. You can identify these
forward-looking statements by terminology such as "will,"
"expects," "anticipates," "future," "intends," "plans," "believes,"
"estimates" and similar statements. The accuracy of these
statements may be impacted by a number of business risks and
uncertainties that could cause actual results to differ materially
from those projected or anticipated, including the ability of
ASAT's management to effectively lead the company, the risk that
ASAT may not be able to attract qualified people to its management
team or retain its existing management and employees, possible
disruptions to its business and operations caused by the changes in
senior management, and those risks outlined in ASAT's filings with
the Securities and Exchange Commission. ASAT does not undertake any
obligation to update this forward-looking information, except as
required under applicable law.
http://www.newscom.com/cgi-bin/prnh/20030414/ASATLOGO
http://photoarchive.ap.org/ DATASOURCE: ASAT Holdings Limited
CONTACT: Jim Fanucchi of Summit IR Group Inc., +1-408-404-5400, ,
for ASAT Holdings Limited Web site: http://www.asat.com/
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