- Development kit demonstrates high data rate, ultra low-power and reliable communication link supported by the ZL(TM)70101 transceiver chip OTTAWA, Sept. 18 /PRNewswire-FirstCall/ -- Zarlink Semiconductor Inc. (NYSE/TSX:ZL) today introduced a development kit that enables faster design and evaluation of wireless telemetry systems linking implanted medical devices with monitoring and programming equipment. Medical device manufacturers are developing telemetry systems that will support new monitoring, diagnostic and therapeutic applications to improve patient care and lower healthcare costs. Zarlink's ZL70101 radio frequency (RF) transceiver chip is being designed into a range of implanted medical devices, including pacemakers, implantable cardioverter defibrillators (ICDs), neurostimulators, drug pumps and physiological monitors, and associated external monitoring and programming equipment. The ZLE70101 Application Development Kit (ADK) demonstrates the high data rate, ultra low-power and reliable communication link supported by the ZL70101 transceiver. The highly integrated RF chip delivers data rates up to 800 kbps and operates in the Medical Implant Communication Service (MICS) 402-405 MHz band. The chip typically consumes 5 milliamps (mA) of supply current in full operation, while incorporating a unique "wake-up" receiver that allows the device to operate in an extremely low current 250 nanoamp (nA) "sleep" mode. The ZL70101 chip includes a fully featured media access controller (MAC), designed specifically for MICS applications, that provides forward error correction, cyclic redundancy check and retransmission to achieve an extremely reliable data link. "Wirelessly enabled medical devices must meet strict performance and power demands to support new applications without impacting implanted device battery life," said Steve Swift, senior vice president and general manager of Zarlink's Medical Communications product group. "The ZLE70101 ADK offers customers a complete hardware and firmware evaluation platform to support the fast development of low-power, standards-compliant medical communication systems built on field-proven MICS technology." Complete hardware and firmware kit The ZLE70101 ADK includes all hardware and firmware required to permit customers to test the performance of the in-air communication link between implanted devices and external equipment. A commonly used application microcontroller is used for both the implant and base station platforms to enable rapid integration into a customer's specific system design. An easy-to-use graphical user interface (GUI) running on a Windows-based PC controls and demonstrates the capabilities of a ZL70101-enabled medical telemetry system. The GUI interfaces to the MICS RF boards via a USB2.0 interface. The kit includes an Applications Development Platform (ADP100) board that interfaces with the PC through a USB2.0 interface to either the implant or base station mezzanine boards. The Application Implant Mezzanine (AIM100) board performs all MICS related implant communications. This board includes the ZL70101 transceiver, discrete circuits including matching networks for normal data transmission and wake-up operation, an application microcontroller connected to the ZL70101 over an industry-standard SPI bus, and an SMA connector interface to a PCB-based loop antenna. The board operates on an included battery to simulate normal implant operation. The Base Station Mezzanine (BSM100) board performs all MICS-related base station/monitoring equipment communications processing. The board includes the same features as the AIM100, with the addition of a wake-up transmitter subsystem and a received signal strength indicator (RSSI) filter for performing clear channel assessment (CCA). The BSM100 also includes a dual-band antenna optimized for performance in the MICS band and supporting wake-up signaling. Also included is a MICS Test Adaptor (MT100) board that enables the probing of key digital and analog signals for the ZL70101 chip on either the implant or base station board. A Programmable Cable Adaptor (PCA100) board and cable enables programming and debugging support for the included applications microcontroller. The ZLE70101 ADK is supported by extensive documentation, including a ZLE70101 ADK user guide, source code overview and board-level documents with schematics, layout, Gerber files and bill-of-material. To save valuable time in the development process, the ADP100, AIM100 and BSM100 are fully supported by embedded firmware with thoroughly commented source code to help developers quickly understand the programming requirements of the ZL70101 chip while allowing for firmware reuse. Availability For a complete description of the ZLE70101 ADK, including block diagrams and photos, please visit http://products.zarlink.com/product_profiles/ZL70101.htm and download the ZLE70101 ADK Product Preview. The ZLE70101 ADK (product order number ZLE70101 BADA) is now available for qualified customers. To learn how to become a qualified customer, please contact Zarlink Semiconductor's Medical Communications sales team at http://ulp.zarlink.com/ulp_sales_contacts.htm. For more information on Zarlink's ZL70101 MICS transceiver chip, please visit: http://products.zarlink.com/product_profiles/ZL70101.htm. About Zarlink Semiconductor For over 30 years, Zarlink Semiconductor has delivered semiconductor solutions that drive the capabilities of voice, enterprise, broadband and wireless communications. The Company's success is built on its technology strengths including voice and data networks, optoelectronics and ultra low-power communications. For more information, visit http://www.zarlink.com/. Shareholders and other individuals wishing to receive, free of charge, copies of the reports filed with the U.S. Securities and Exchange Commission and Regulatory Authorities, should visit the Company's web site at http://www.zarlink.com/ or contact Investor Relations. Certain statements in this press release constitute forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. Such forward-looking statements involve known and unknown risks, uncertainties, and other factors which may cause the actual results, performance or achievements of the Company to be materially different from any future results, performance, or achievements expressed or implied by such forward-looking statements. Such risks, uncertainties and assumptions include, among others, the following: our dependence on the successful development and market introduction of new products; our ability to successfully integrate businesses acquired in the future; our ability to operate profitably and generate positive cash flows in the future; our dependence on our foundry suppliers and third-party subcontractors; order cancellations and deferrals by our customers; and other factors referenced in our Annual Report on Form 20-F. Investors are encouraged to consider the risks detailed in this filing. Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. DATASOURCE: ZARLINK SEMICONDUCTOR CONTACT: Ed Goffin, Media Relations, (613) 270-7112, ; Mike McGinn, Investor Relations, (613) 270-7210,

Copyright