Part of Collaborative European Project to
Deliver Advances in Power Converters for Aircraft
Applications
Listing: TSX Venture Exchange
Symbol: DNX
LINCOLN, England, Sept. 28, 2015 /CNW/ - Dynex Power Inc., a
leading specialist high power semiconductor company, today
announced that its subsidiary, Dynex Semiconductor Ltd, had been
awarded grants totaling €1 million by the European Union's
Horizon 2020 Research and Innovation Programme to develop the next
generation of electronic components for use in aircraft.
The grant will fund Dynex's costs as a partner in a three year,
€7 million project being coordinated by Siemens AG. The project,
known as the Integrated, Intelligent Modular Power Electronic
Converter Project (or I2MPECT for short) is being carried out by a
pan European consortium of nine organizations and is designed to
provide significant advances in the state of the art in power
converters for aircraft applications thus improving the
competiveness of European aviation through cost efficiency and
innovation.
Dynex's contribution to the project will be to deliver
innovative 3D power semiconductor device packaging based on planar
interconnect technologies with double-sided integrated cooling for
wide band-gap wire-bond free power semiconductor devices.
Dr Steve Jones, IGBT Module
Technology Manager and Dynex Project Leader for the I2MPECT Project
commented "We are delighted by this award. Dynex has significant
technological strengths in IGBT and power module packaging and we
see this project as an exciting opportunity to extend our
technology into the aviation sector". Dr Jones continued, "This
grant follows on from our success last year in winning a grant from
the Technology Strategy Board, the UK's innovation agency, to work
in a consortium with Cummins to develop IGBT power module packages
for automotive applications".
This project has received funding from the European Union's
Horizon 2020 research and innovation programme under grant
agreement No 636170.
About the Company
Dynex designs and manufactures high power bipolar
semiconductors, high power insulated gate bipolar transistor (IGBT)
modules, high power electronic assemblies and radiation hard
silicon-on-sapphire integrated circuits (SOS IC's). The company's
power products are used worldwide in power electronic applications
including electric power transmission and distribution, renewable
and distributed energy, marine and rail traction motor drives,
aerospace, electric vehicles, industrial automation and controls
and power supplies. Our IC products are used in demanding
applications in the aerospace industry. Dynex Semiconductor Ltd is
its only operating business and is based in Lincoln, England in a facility housing the
fully integrated silicon fabrication, assembly and test, sales,
design and development operations. Dynex is majority owned by
Zhuzhou CSR Times Electric Co., Ltd.
Zhuzhou CSR Times Electric Co., Ltd. is based in Hunan Province in the People's Republic of China. It is listed
on the Hong Kong Stock Exchange. CSR Times Electric is mainly
engaged in the research, development, manufacture and sales of
locomotive train power converters, control systems and other
train-borne electrical systems, as well as the development,
manufacturing and sales of urban railway train electrical systems.
In addition, CSR Times Electric is also engaged in the design,
manufacturing and sales of electric components including power
semiconductor devices for the railway industry, urban railway
industry and non-railway purposes.
Press announcements and other information about Dynex Power Inc
are available at www.dynexpower.com
Information about Dynex Semiconductor Ltd and its products can
be found at www.dynexsemi.com
Further information on CSR Times Electric can be found at
www.timeselectric.cn/en
All monetary values expressed in this release are in Canadian
Dollars unless stated otherwise.
The TSX Venture Exchange has neither approved nor disapproved of
the information in this press release.
SOURCE Dynex Power Inc.