Highland Copper Announces Further Extension of Loan Maturity Date
05 Août 2020 - 12:36AM
Highland Copper Company Inc. (TSXV: HI, OTCQB: HDRSF) (the
“Company”) announced today that the maturity date for the repayment
of outstanding indebtedness under its credit agreement with
Greenstone Resources II LP and Osisko Gold Royalties Ltd., of
US$4,500,000 (the “Loan”), was extended to August 15, 2020.
Additional information about the Loan can be found in previous
press releases including those issued on May 21, 2019 and July 2,
2020, each of which are available on the Company’s website at
www.highlandcopper.com and on SEDAR at www.sedar.com.
About Highland
Highland Copper Company Inc. is a Canadian
company focused on exploring and developing copper projects in the
Upper Peninsula of Michigan, U.S.A. More information about the
Company is available on the Company’s website at
www.highlandcopper.com and on SEDAR at www.sedar.com.
Neither the TSX Venture Exchange nor its
Regulation Services Provider (as that term is defined in the
policies of the TSX Venture Exchange) accepts responsibility for
the adequacy or accuracy of this release.
For further information, please contact:
Denis Miville-Deschênes, President & CEO
Tel: +1.450.677.2455Email: info@highlandcopper.com
Highland Copper (TSXV:HI)
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