ST. FLORIAN, Austria and TOKYO, March 14,
2012 /PRNewswire/ -- EV Group (EVG), a leading supplier
of wafer bonding and lithography equipment for the MEMS,
nanotechnology and semiconductor markets, today announced that
Shin-Etsu Chemical Co., Ltd., the world's largest supplier of
semiconductor materials, has joined EVG's open platform for
temporary bonding/debonding (TB/DB) materials. Shin-Etsu's
advanced adhesives will be qualified with EVG's EZR® (Edge Zone
Release) and EZD® (Edge Zone Debond) modules, which support the new
ZoneBOND™ room temperature debonding process used in the production
of 3D ICs.
"We are proud to be a partner in EVG's open platform for
temporary bonding and debonding materials. Having worked
closely with EVG's process development teams, we are pleased to
have successfully completed the stringent test procedures for their
ZoneBOND™ equipment. We look forward to working with
customers that require temporary bonding to commercialize 3D
packaging in a volume manufacturing environment," stated
Jim Edmonds, president, Shin-Etsu
MicroSi, Inc.
Markus Wimplinger, EVG's corporate technology development and IP
director, commented, "Through our open materials platform approach,
we are building a strong supply chain for EVG's market-leading
TB/DB technologies—unlocking another key barrier in the advancement
of 3D IC commercialization. Enabling the use of a wide range
of adhesives from various suppliers for our equipment gives
customers the most flexible choice of bonding materials for
increased flexibility during thin wafer processing."
ZoneBOND™ capable technology, in tandem with EVG's breakthrough
EZR® (Edge Zone Release) and EZD® (Edge Zone Debond) modules,
provides a superior approach for temporary wafer bonding, thin
wafer processing, and debonding applications—overcoming the last
remaining limitations associated with thin wafer processing.
Benefits of EVG's TB/DB equipment solutions and open
materials platform include: the use of silicon, glass and other
carriers; compatibility with existing, field-proven adhesive
platforms; and the ability to debond at room temperature with
virtually no vertical force being applied to the device wafer.
To support grinding and backside processing at high
temperatures and to allow for low-force carrier separation, the
concept defines two distinctive zones on the carrier wafer surface
with strong adhesion in the perimeter (edge zone) and minimal
adhesion in the center zone. As a result, low separation
force is only required for carrier separation once the polymeric
edge adhesive has been removed by solvent dissolution or other
means.
For further insight into the ZoneBOND™ approach, please view the
recent webcast "3D is a Reality in High-volume Manufacturing"
hosted by Yole Developpement available at:
http://www.i-micronews.com/consult_webcast.asp?uid=63
About Shin-Etsu Chemical Co., Ltd.
Shin-Etsu Chemical Co., Ltd., the Tokyo based chemical company, is the world's
largest supplier of semiconductor materials, semiconductor silicon,
PVC resin, synthetic quartz glass and methylcellulose and is a
major producer of materials including silicones and rare earth
magnets. Shin-Etsu Chemical's stock (TSE: 4063) is listed on three
markets: The Tokyo, Osaka and Nagoya Exchanges in Japan. http://www.shinetsu.co.jp
Shin-Etsu MicroSi, Inc. is a wholly owned subsidiary of
Shin-Etsu Chemical Co., Ltd. With its headquarters in
Phoenix, Arizona, Shin-Etsu
MicroSi provides high performance products and materials,
specifically designed to address today's photolithography,
packaging, solar and flexible printed circuit requirements.
www.microsi.com
About EV Group (EVG)
EV Group (EVG) is a world leader in wafer-processing solutions
for semiconductor, MEMS and nanotechnology applications.
Through close collaboration with its global customers, the company
implements its flexible manufacturing model to develop reliable,
high-quality, low-cost-of-ownership systems that are easily
integrated into customers' fab lines. Key products include
wafer bonding, lithography/nanoimprint lithography (NIL) and
metrology equipment, as well as photoresist coaters, cleaners and
inspection systems.
In addition to its dominant share of the market for wafer
bonders, EVG holds a leading position in NIL and lithography for
advanced packaging and MEMS. Along these lines, the company
co-founded the EMC-3D consortium in 2006 to create and help drive
implementation of a cost-effective through-silicon via (TSV)
process for major ICs and MEMS/sensors. Other target
semiconductor-related markets include silicon-on-insulator (SOI),
compound semiconductor and silicon-based power-device
solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer
support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; Seoul, Korea and Chung-Li, Taiwan. More
information is available at www.EVGroup.com.
SOURCE EV Group