ACM Research Announces Receipt of Purchase Order from a Large U.S. Manufacturer
07 Novembre 2023 - 10:55AM
ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier
of wafer processing solutions for semiconductor and advanced
wafer-level packaging applications, today announced the receipt of
a purchase order for its Ultra C b backside clean and bevel etch
tool from a major U.S. semiconductor manufacturer. The tool is
expected to be shipped to the prospective customer’s U.S. facility
in the second quarter of 2024.
“We believe this new order from a large U.S. manufacturer
underscores the strength of ACM’s technology and marks another key
milestone in our international market expansion,” said ACM’s
President and Chief Executive Officer, Dr. David Wang, CEO. “The
tool combines backside cleaning and bevel etcher function and is in
addition to the ongoing evaluation by this customer of two SAPS
cleaning tools, and we believe this demonstrates a deepening
relationship which we hope will result in demand for additional ACM
tools. Furthermore, we expect this order to enhance ACM’s brand and
to position us to attract new opportunities with other major global
customers.”
About the Ultra C b Backside Clean and Bevel Etch
Tool
ACM’s Ultra C b backside cleaning portfolio supports 200mm and
300mm wafers, pivotal in IC wafer manufacturing, wafer-level
packaging, and the power device sector. Utilizing a unique
contactless Bernoulli wafer chuck, it ensures the wafer's front
side remains undamaged, delivering nitrogen gas to shield the
device side from any chemical exposure. The system stands out for
its superior particle performance, etch uniformity, and
customization options, satisfying stringent undercut specifications
on wafer bevels while maintaining a pin mark-free environment.
The Ultra C b excels in throughput, capable of handling over 300
wafers per hour for certain applications, and offers versatility
through its precise chemical processes for silicon etching or film
removal. It accommodates a wide range of substrates, including
heavily doped, bonded, and ultra-thin wafers, even those with high
warpage. Additionally, the tool's adaptability is enhanced with an
optional non-contact robot for specialized wafer handling,
reaffirming ACM's commitment to innovation and tailored
semiconductor manufacturing solutions.
ACM’s Ultra C bevel etch uses a wet etch method to remove
various types of dielectric, metal and organic material films, as
well as particulate contaminants on the wafer edge. Using wet etch
also avoids the arcing and silicon damage risk from the dry
process. The bevel etch process is performed in the front end
before copper metallization and in the back end after copper
metallization. ACM attains superior results with our single-wafer
bevel etch system, which combines bevel and backside cleaning.
Forward-Looking Statements
Certain statements contained in this press release are not
historical facts and may be forward-looking statements within the
meaning of the Private Securities Litigation Reform Act of 1995.
Words such as “plans,” “expects,” “believes,” “anticipates,”
“designed,” and similar words are intended to identify
forward-looking statements. Forward-looking statements are based on
ACM management’s current expectations and beliefs, and involve a
number of risks and uncertainties that are difficult to predict and
that could cause actual results to differ materially from those
stated or implied by the forward-looking statements. A description
of certain of these risks, uncertainties and other matters can be
found in filings ACM makes with the U.S. Securities and Exchange
Commission, all of which are available at www.sec.gov. Because
forward-looking statements involve risks and uncertainties, actual
results and events may differ materially from results and events
currently expected by ACM. Readers are cautioned not to place undue
reliance on these forward-looking statements, which speak only as
of the date hereof. ACM undertakes no obligation to publicly update
these forward-looking statements to reflect events or circumstances
that occur after the date hereof or to reflect any change in its
expectations with regard to these forward-looking statements or the
occurrence of unanticipated events.
About ACM Research, Inc.ACM develops,
manufactures, and sells semiconductor process equipment for
single-wafer or batch wet cleaning, electroplating, stress-free
polishing and thermal processes that are critical to advanced
semiconductor device manufacturing, as well as wafer-level
packaging. ACM is committed to delivering customized,
high-performance, cost-effective process solutions that
semiconductor manufacturers can use in numerous manufacturing steps
to improve productivity and product yield. For more information,
visit www.acmrcsh.com.
© ACM Research, Inc., SAPS and the ACM Research logo are
trademarks of ACM Research, Inc. For convenience, these trademarks
appear in this press release without a ™ symbol, but that practice
does not mean ACM will not assert, to the fullest extent under
applicable law, its rights to such trademarks.
Media
Contact: |
Company
Contacts: |
Shannon Blood |
USA |
Kiterocket |
Robert Metter |
+1 208-216-9180 |
+1 503.367.9753 |
sblood@kiterocket.com |
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China |
|
Xi Wang |
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ACM Research (Shanghai),
Inc. |
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+86 21 50808868 |
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Korea |
|
YY Kim |
|
ACM Research (Korea),
Inc. |
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+821041415171 |
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Taiwan |
|
David Chang |
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+886 921999884 |
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Singapore |
|
Adrian Ong |
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+65 8813-1107 |
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