Today at the Computex 2024 opening keynote, AMD (NASDAQ: AMD)
detailed new leadership CPU, NPU and GPU architectures powering
end-to-end AI infrastructure from the data center to PCs. AMD
unveiled an expanded AMD Instinct™ accelerator roadmap, introducing
an annual cadence of leadership AI accelerators including the new
AMD Instinct MI325X accelerator with industry-leading memory
capacity planned to be available in Q4 2024. AMD also previewed 5th
Gen AMD EPYC™ server processors, on track to launch in 2H 2024,
with leadership performance and efficiency. AMD announced AMD
Ryzen™ AI 300 Series, the third generation of AMD AI-enabled mobile
processors, and AMD Ryzen 9000 Series processors for laptop and
desktop PCs, respectively.
“This is an incredibly exciting time for AMD as the rapid and
accelerating adoption of AI is driving increased demand for our
high-performance computing platforms,” said Dr. Lisa Su, chair and
CEO. “At Computex, we were proud to be joined by Microsoft, HP,
Lenovo, Asus and other strategic partners to launch our
next-generation Ryzen desktop and notebook processors, preview the
leadership performance of our next-generation EPYC processors, and
announce a new annual cadence for AMD Instinct AI
accelerators.”
“We are in the midst of a massive AI platform shift, with the
promise to transform how we live and work. That’s why our deep
partnership with AMD, which has spanned multiple computing
platforms, from the PC to custom silicon for Xbox, and now to AI,
is so important to us,” said Satya Nadella, Chairman and CEO of
Microsoft. “We are excited to partner with AMD to deliver these new
Ryzen AI powered Copilot+ PCs. We are very committed to our
collaboration with AMD and we’ll continue to push AI progress
forward together across the cloud and edge to bring new value to
our joint customers.”
Delivering Leadership AI and Enterprise Compute for the
Data CenterAMD detailed its expanded multi-generational
accelerator roadmap, showing how it plans to deliver performance
and memory leadership on an annual cadence for generative AI. The
expanded roadmap includes the AMD Instinct MI325X accelerators,
with planned availability in Q4 2024, delivering industry leading
memory capacity with 288GB of ultra-fast HBM3E memory1 that extends
AMD generative AI performance leadership2. The next-generation AMD
CDNA™ 4 architecture, expected in 2025, will power the AMD Instinct
MI350 Series and is expected to drive up to 35x better AI inference
performance compared to AMD Instinct MI300 Series with AMD CDNA 33.
Continuing performance and feature improvements, the CDNA “Next”
architecture will power MI400 series accelerators planned for
2026.
Previewed today at Computex, 5th Gen AMD EPYC processors
(codenamed “Turin”) will leverage the “Zen 5” core and continue the
leadership performance and efficiency of the AMD EPYC processor
family. 5th Gen AMD EPYC processors are targeted for availability
in 2H of 2024.
At the keynote, Microsoft CEO Satya Nadella highlighted how AMD
Instinct MI300X accelerators deliver leading price/performance on
GPT-4 inference for Microsoft Azure workloads.
Reimagining the PC to Enable Intelligent, Personal
ExperiencesDr. Su was joined by executives from Microsoft,
HP®, Lenovo® and Asus to unveil new PC experiences powered by 3rd
Gen AMD Ryzen AI 300 Series processors and AMD Ryzen 9000 Series
desktop processors.
AMD detailed its next generation “Zen 5” CPU core, built from
the ground up for leadership performance and energy efficiency
spanning from supercomputers and the cloud to PCs. AMD also
unveiled the AMD XDNA™ 2 NPU core architecture that delivers 50
TOPs of AI processing performance4 and up to 2x projected power
efficiency for generative AI workloads compared to the prior
generation5. The AMD XDNA 2 architecture-based NPU is the
industry’s first and only NPU supporting advanced Block FP16 data
type6, delivering increased accuracy compared to lower precision
data types used by competitive NPUs without sacrificing
performance. Together, “Zen 5,” AMD XDNA 2 and AMD RDNA™ 3.5
graphics enable next-gen AI experiences in laptops powered by AMD
Ryzen AI 300 Series processors.
On stage at Computex, ecosystem partners showcased how they are
working with AMD to unlock new AI experiences for PCs. Microsoft
highlighted its longstanding partnership with AMD and announced AMD
Ryzen AI 300 Series processors exceed Microsoft’s Copilot+ PC
requirements. HP unveiled new Copilot+ PCs powered by AMD,
including the HP Pavilion Aero, and demonstrated image generator
Stable Diffusion XL Turbo running locally on an HP laptop powered
by a Ryzen AI 300 Series processor. Lenovo revealed upcoming
consumer and commercial laptops powered by Ryzen AI 300 Series
processors and highlighted how it is leveraging Ryzen AI to enable
new Lenovo AI software. Asus showcased a broad portfolio of AI PCs
for business users, consumers, content creators and gamers powered
by Ryzen AI 300 Series processors.
AMD also unveiled the AMD Ryzen 9000 Series desktop processors
based on the “Zen 5” architecture, delivering leadership
performance in gaming, productivity and content creation. AMD Ryzen
9 9950X processors are the world’s fastest consumer desktop
processors7.
Separately, AMD also announced the AMD Radeon™ PRO W7900 Dual
Slot workstation graphics card, optimized to deliver scalable AI
performance for platforms supporting multiple GPUs. AMD also
unveiled AMD ROCm™ 6.1 for AMD Radeon GPUs, designed to make AI
development and deployment with AMD Radeon desktop GPUs more
compatible, accessible and scalable.
Powering the Next Wave of Edge AI InnovationAMD
showcased how its AI and adaptive computing technology is powering
the next wave of AI innovation at the edge. Only AMD combines all
the IP required for whole edge AI application acceleration. The new
AMD Versal™ AI Edge Series Gen 2 brings together FPGA programmable
logic for real-time pre-processing, next-gen AI Engines powered by
XDNA technology for efficient AI inference, and embedded CPUs for
post-processing to deliver the highest performing single chip
adaptive solution for edge AI. AMD Versal AI Edge Gen 2 devices are
available now for early access with over 30 key partners currently
in development.
AMD showcased how it is enabling AI at the edge across
verticals, including:
- Illumina is using advanced AMD technology to unlock the power
of genome sequencing.
- Subaru is using AMD Versal AI Edge Gen 2 devices to power its
EyeSight ADAS Platform to help enable Subaru’s “zero-fatalities”
mission by 2030.
- Canon uses the Versal AI Core series for its Free Viewpoint
Video System, revolutionizing viewing experience for live sport
broadcasts and webcasts.
- Hitachi Energy’s HVDC protection relays predict electrical
overvoltage using AMD adaptive computing technology for real-time
processing.
Supporting Resources
- Watch the full keynote here
- Learn more about all the Computex news here
About AMDFor more than 50 years AMD has driven
innovation in high-performance computing, graphics and
visualization technologies. Billions of people, leading Fortune 500
businesses and cutting-edge scientific research institutions around
the world rely on AMD technology daily to improve how they live,
work and play. AMD employees are focused on building leadership
high-performance and adaptive products that push the boundaries of
what is possible. For more information about how AMD is enabling
today and inspiring tomorrow, visit the AMD (NASDAQ: AMD) website,
blog, LinkedIn and X pages.
Cautionary Statement This press release
contains forward-looking statements concerning Advanced Micro
Devices, Inc. (AMD) such as the features, functionality,
performance, availability, timing and expected benefits of AMD
products and technology including 5th Gen AMD EPYC™ processors, AMD
Ryzen™ AI 300 Series processors, AMD Ryzen™ 9000 Series desktop
processors, the AMD Instinct™ accelerator family, AMD CDNA™ 4 and
AMD CDNA™ “Next”, “Zen 5” CPU architecture, AMD XDNA™ 2 NPU
architecture, AMD RDNA™ 3.5 GPU architecture, AMD Radeon™ PRO W7900
Dual Slot workstation GPUs, AMD ROCm™ 6.1 for AMD Radeon™ GPUs;
product roadmaps and leadership AI performance, which are made
pursuant to the Safe Harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements are
commonly identified by words such as "would," "may," "expects,"
"believes," "plans," "intends," "projects" and other terms with
similar meaning. Investors are cautioned that the forward-looking
statements in this press release are based on current beliefs,
assumptions and expectations, speak only as of the date of this
press release and involve risks and uncertainties that could cause
actual results to differ materially from current expectations. Such
statements are subject to certain known and unknown risks and
uncertainties, many of which are difficult to predict and generally
beyond AMD's control, that could cause actual results and other
future events to differ materially from those expressed in, or
implied or projected by, the forward-looking information and
statements. Material factors that could cause actual results to
differ materially from current expectations include, without
limitation, the following: Intel Corporation’s dominance of the
microprocessor market and its aggressive business practices;
cyclical nature of the semiconductor industry; market conditions of
the industries in which AMD products are sold; loss of a
significant customer; competitive markets in which AMD’s products
are sold; economic and market uncertainty; quarterly and seasonal
sales patterns; AMD's ability to adequately protect its technology
or other intellectual property; unfavorable currency exchange rate
fluctuations; ability of third party manufacturers to manufacture
AMD's products on a timely basis in sufficient quantities and using
competitive technologies; availability of essential equipment,
materials, substrates or manufacturing processes; ability to
achieve expected manufacturing yields for AMD’s products; AMD's
ability to introduce products on a timely basis with expected
features and performance levels; AMD's ability to generate revenue
from its semi-custom SoC products; potential security
vulnerabilities; potential security incidents including IT outages,
data loss, data breaches and cyberattacks; uncertainties involving
the ordering and shipment of AMD’s products; AMD’s reliance on
third-party intellectual property to design and introduce new
products in a timely manner; AMD's reliance on third-party
companies for design, manufacture and supply of motherboards,
software, memory and other computer platform components; AMD's
reliance on Microsoft and other software vendors' support to design
and develop software to run on AMD’s products; AMD’s reliance on
third-party distributors and add-in-board partners; impact of
modification or interruption of AMD’s internal business processes
and information systems; compatibility of AMD’s products with some
or all industry-standard software and hardware; costs related to
defective products; efficiency of AMD's supply chain; AMD's ability
to rely on third party supply-chain logistics functions; AMD’s
ability to effectively control sales of its products on the gray
market; long-term impact of climate change on AMD’s business;
impact of government actions and regulations such as export
regulations, tariffs and trade protection measures; AMD’s ability
to realize its deferred tax assets; potential tax liabilities;
current and future claims and litigation; impact of environmental
laws, conflict minerals-related provisions and other laws or
regulations; evolving expectations from governments, investors,
customers and other stakeholders regarding corporate responsibility
matters; issues related to the responsible use of AI; restrictions
imposed by agreements governing AMD’s notes, the guarantees of
Xilinx’s notes and the revolving credit facility; impact of
acquisitions, joint ventures and/or investments on AMD’s business
and AMD’s ability to integrate acquired businesses; impact of any
impairment of the combined company’s assets; political, legal and
economic risks and natural disasters; future impairments of
technology license purchases; AMD’s ability to attract and retain
qualified personnel; and AMD’s stock price volatility. Investors
are urged to review in detail the risks and uncertainties in AMD’s
Securities and Exchange Commission filings, including but not
limited to AMD’s most recent reports on Forms 10-K and
10-Q.
Ryzen™ AI is defined as the combination of a dedicated AI
engine, AMD Radeon™ graphics engine, and Ryzen processor cores that
enable AI capabilities. OEM and ISV enablement is required, and
certain AI features may not yet be optimized for Ryzen AI
processors. Ryzen AI is compatible with: (a) AMD Ryzen 7040 and
8040 Series processors except Ryzen 5 7540U, Ryzen 5 8540U, Ryzen 3
7440U, and Ryzen 3 8440U processors; (b) AMD Ryzen AI 300 Series
processors, and (c) all AMD Ryzen 8000G Series desktop processors
except the Ryzen 5 8500G/GE and Ryzen 3 8300G/GE. Please check with
your system manufacturer for feature availability prior to
purchase. GD-220c.
Radeon™ PRO Series and Radeon RX Series graphics cards mentioned
herein are not designed, marketed nor recommended for datacenter
usage. Use in a datacenter setting may adversely affect
manageability, efficiency, reliability, and/or performance.
GD-239s.
© 2024 Advanced Micro Devices, Inc. All rights reserved. AMD,
the AMD Arrow logo, AMD Instinct, AMD EPYC, AMD RDNA, AMD XDNA,
Radeon, Ryzen, Versal, and combinations thereof are trademarks of
Advanced Micro Devices, Inc. HP® and the HP logo are registered
trademarks of Hewlett-Packard Development Company, L.P Lenovo® is a
trademark of Lenovo in the United States, other countries, or both.
Other product names used in this publication are for identification
purposes only and may be trademarks of their respective owners.
Certain AMD technologies may require third-party enablement or
activation. Supported features may vary by operating system. Please
confirm with the system manufacturer for specific features. No
technology or product can be completely secure.
_________________________
1 MI300-48 - Calculations conducted by AMD Performance Labs as
of May 22nd, 2024, based on current specifications and /or
estimation. The AMD Instinct™ MI325X OAM accelerator is projected
to have 288GB HBM3e memory capacity and 6 TFLOPS peak theoretical
memory bandwidth performance. Actual results based on production
silicon may vary. The highest published results on the NVidia
Hopper H200 (141GB) SXM GPU accelerator resulted in 141GB HBM3e
memory capacity and 4.8 TB/s GPU memory bandwidth performance.
https://nvdam.widen.net/s/nb5zzzsjdf/hpc-datasheet-sc23-h200-datasheet-3002446
The highest published results on the NVidia Blackwell HGX B100
(192GB) 700W GPU accelerator resulted in 192GB HBM3e memory
capacity and 8 TB/s GPU memory bandwidth performance.
https://resources.nvidia.com/en-us-blackwell-architecture?_gl=1*1r4pme7*_gcl_aw*R0NMLjE3MTM5NjQ3NTAuQ2p3S0NBancyNkt4we
know
QmhCREVpd0F1NktYdDlweXY1dlUtaHNKNmhPdHM4UVdPSlM3dFdQaE40WkI4THZBaWFVajFyTGhYd3hLQmlZQ3pCb0NsVElRQXZEX0J3RQ..*_gcl_au*MTIwNjg4NjU0Ny4xNzExMDM1NTQ3
The highest published results on the NVidia Blackwell HGX B200
(192GB) GPU accelerator resulted in 192GB HBM3e memory capacity and
8 TB/s GPU memory bandwidth performance.
https://resources.nvidia.com/en-us-blackwell-architecture?_gl=1*1r4pme7*_gcl_aw*R0NMLjE3MTM5NjQ3NTAuQ2p3S0NBancyNkt4QmhCREVpd0F1NktYdDlweXY1dlUtaHNKNmhPdHM4UVdPSlM3dFdQaE40WkI4THZBaWFVajFyTGhYd3hLQmlZQ3pCb0NsVElRQXZEX0J3RQ..*_gcl_au*MTIwNjg4NjU0Ny4xNzExMDM1NTQ3
2 MI300-49: Calculations conducted by AMD Performance Labs as of
May 28th, 2024 for the AMD Instinct™ MI325X GPU at 2,100 MHz peak
boost engine clock resulted in 1307.4 TFLOPS peak theoretical half
precision (FP16), 1307.4 TFLOPS peak theoretical Bfloat16 format
precision (BF16), 2614.9 TFLOPS peak theoretical 8-bit precision
(FP8), 2614.9 TOPs INT8 floating-point performance. Actual
performance will vary based on final specifications and system
configuration.Published results on Nvidia H200 SXM (141GB) GPU:
989.4 TFLOPS peak theoretical half precision tensor (FP16 Tensor),
989.4 TFLOPS peak theoretical Bfloat16 tensor format precision
(BF16 Tensor), 1,978.9 TFLOPS peak theoretical 8-bit precision
(FP8), 1,978.9 TOPs peak theoretical INT8 floating-point
performance. BFLOAT16 Tensor Core, FP16 Tensor Core, FP8 Tensor
Core and INT8 Tensor Core performance were published by Nvidia
using sparsity; for the purposes of comparison, AMD converted these
numbers to non-sparsity/dense by dividing by 2, and these numbers
appear above.3 MI300-55: Inference performance projections as of
May 31, 2024 using engineering estimates based on the design of a
future AMD CDNA 4-based Instinct MI350 Series accelerator as proxy
for projected AMD CDNA™ 4 performance. A 1.8T GPT MoE model was
evaluated assuming a token-to-token latency = 70ms real time, first
token latency = 5s, input sequence length = 8k, output sequence
length = 256, assuming a 4x 8-mode MI350 series proxy (CDNA4) vs.
8x MI300X per GPU performance comparison. Actual performance will
vary based on factors including but not limited to final
specifications of production silicon, system configuration and
inference model and size used4 Trillions of Operations per Second
(TOPS) for an AMD Ryzen processor is the maximum number of
operations per second that can be executed in an optimal scenario
and may not be typical. TOPS may vary based on several factors,
including the specific system configuration, AI model, and software
version. GD-243.5 Based on performance and power estimates
correlated to measurements on hardware platforms as of May 2024
comparing projected Stable Diffusion iterations per second per watt
for Ryzen AI 300 Series processor to a Ryzen 8945HS
processor. Configuration for Ryzen AI 300 Series Processor:
Reference platform, 32GB RAM, Radeon 890M graphics, Windows 11 Pro.
Configuration for the Ryzen 8945HS processor is: Razer Blade 14,
32GB RAM, Radeon 780M graphics, Windows 11 Home. Specific
projections are are subject to change when final products are
released in market. STX-14.6 As of May 2024, AMD has the first
available NPU on a laptop PC processor (AMD Ryzen™ AI 300 Series
processor) that supports Block FP16 functionality, where 'dedicated
AI engine' is defined as an AI engine that has no function other
than to process AI inference models and is part of the x86
processor die. STX-16.7 Testing as of May 2024 by AMD Performance
Labs on test systems configured as follows: AMD Ryzen 9 9950X
system: GIGABYTE X670E AORUS
MASTER, Balanced, DDR5-6000, Radeon RX 7900 XTX,
VBS=On,SAM=On KRACKENX63 (May 10, 2024) vs. similarly
configured Intel Core i9-14900KS system: MSI MEG Z790 ACE MAX
(MS-7D86), Balanced, DDR5-6000, Radeon RX 7900 XTX,
VBS=On,SAM=On KRAKENX63 (May 13, 2024) {Profile=Intel Default}
on the following applications: 3DMarkDandia, Blender, Cinebench,
GeekBench, PCMark10, PassMark, ProcyonOffice, ProcyonPhotoEditing,
ProcyonVideoEditing. System manufacturers may vary configurations,
yielding different results. GNR-01.
Contact:Brandi
Martina AMD Communications(512)
705-1720brandi.martina@amd.com
Suresh BhaskaranAMD Investor
Relations408-749-2845suresh.bhaskaran@amd.com
Advanced Micro Devices (NASDAQ:AMD)
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