SkyWater is the first domestic provider of
Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to
support the reshoring of the semiconductor supply chain
SkyWater Technology (NASDAQ: SKYT), the trusted technology
realization partner, and Deca Technologies (Deca), a leading
provider of advanced electronic interconnect technology, today
announced the kick-off of a significant new Department of Defense
(DOD) effort to expand domestic fan-out wafer level packaging
(FOWLP) capabilities for both government and commercial customers.
These capabilities will be made possible through the five-year DOD
contract recently awarded to Osceola County and SkyWater Florida,
which is expected to fund the facilitization, tooling and build-out
of the Center for Neovation. With an expected value of $120 million
over five years, the award includes options for an additional $70
million, for a total value of up to $190 million. SkyWater is the
first domestic licensee of Deca’s M-Series and Adaptive Patterning
solutions to support the reshoring of the semiconductor supply
chain.
The first generation of Deca’s M-Series FOWLP is broadly adopted
across multiple device technology nodes in leading smartphones.
Deca’s Gen 2 M-Series delivers a powerful new heterogenous
integration solution for designers and manufacturers by
streamlining the design and assembly processes and providing
additional flexibility for multi-chip architectures with sub 20µm
pitch. The Gen 2 M-series provides advantages to many markets such
as artificial intelligence, high-performance computing and other
advanced applications, giving system architects limitless potential
through reticle-free maskless digital lithography and the
flexibility of a molded interposer layer.
Through SkyWater’s collaboration with Deca, embedded devices
including active and passive bridge die, integrated passives and a
powerful technology roadmap are planned. SkyWater will implement
Deca’s Adaptive Patterning, the industry’s only real-time
design-during-manufacturing capability, allowing designers to scale
to unprecedented device interface density with wider process
windows for robust manufacturability.
The award is part of the DOD’s Office of the Secretary of
Defense (OSD’s) Re-shore Ecosystem for Secure Heterogeneous
Advanced Packaged Electronics (RESHAPE) efforts, and directly
supports the Biden-Harris Administration’s initiatives to
strengthen America’s supply chains. This initiative is significant
as less than 3% of semiconductor advanced packaging manufacturing
takes place in the U.S., posing national security and economic
risks for domestic businesses as chips go overseas for this
critical step.
In response to the vital need for reshoring, Osceola County and
SkyWater plan to stand up advanced packaging capabilities and
capacity for low-volume/high-mix production of secure 2.5 and 3D
Advanced System Integration and Packaging (ASIP) solutions. To
onshore these advanced packaging capabilities, SkyWater will be
acquiring, installing, and qualifying new equipment at its Florida
facility that can support FOWLP processing of incoming 200mm and
300mm device wafer formats. This dual-wafer size equipment
capability provides the flexibility to support a vast array of
customers and applications.
Statements about the RESHAPE Program Award:
Matt Walsh, Office of the Secretary of Defense IBAS advanced
packaging chief engineer said, “We are very excited about
supporting domestic advanced packaging solutions by enabling
SkyWater and Deca to establish developmental and volume
manufacturing FOWLP technology for commercial and government
customers’ applications with technical capability that equals that
of foreign providers.”
SkyWater CEO Thomas Sonderman commented, “This agreement
with the county enables SkyWater Florida to execute all aspects of
the initial DOD award of up to $120 million and stand up our
fan-out wafer level packaging capabilities by utilizing Deca’s
industry leading technology. Our partnership with the county
continues to fortify their efforts to build a thriving community in
Central Florida designed for advancing the next generation of
technologies here in the U.S.”
AMD’s Corporate Vice President, Advanced Packaging Raja
Swaminathan said, “As a leader in chiplet design and advanced
packaging, AMD recognizes the importance of creating a
geographically diverse advanced packaging supply chain. We applaud
the DOD’s work to expand SkyWater’s manufacturing capabilities in
Central Florida and establish a U.S.-based fan-out manufacturing
option using Deca’s technology.”
Deca’s Founder and CEO Tim Olson stated, “We’re excited
to collaborate with SkyWater on this groundbreaking opportunity to
establish an industry leading domestic advanced packaging foundry
supporting a secure U.S. microelectronics ecosystem as well as
providing commercial customers with a compelling new supply chain
option.”
According to Osceola County Manager, Don Fisher, “This award
builds on all the hard work the county and our partners have
invested in NeoCity. Our continued collaboration with SkyWater will
help drive our progress in developing a vibrant ecosystem to
advance the next generation of technologies that will shape our
future and provide more high quality job opportunities in
Florida.”
SkyWater Florida Vice President and General Manager, Dale
Miller said, “We are excited to establish the first Deca FOWLP
capability in the U.S. This represents our third heterogeneous
integration technology for the Kissimmee facility. It’s an
important addition because it completes our advanced packaging
trifecta of interposer, hybrid bonding, and now fan-out wafer level
packaging technology – all in one facility – to support both DOD
and commercial customers.”
About Deca Technologies
Deca is a leading provider of advanced packaging technology to
the semiconductor industry with M-Series™ fan-out and Adaptive
Patterning®. Deca has a growing list of industry leading partners
working on technology transfer and license agreements to gain
access to the proven structures, processes, materials, equipment,
design systems, and know-how of the industry’s #1 volume fan-out
technology. Starting with the highest quality and reliability in
Gen 1 aimed at smartphone applications and moving on to the growth
of Gen 2 for chiplets and heterogeneous integration, Deca’s
technologies are emerging as key industry standards for the future.
For more information, visit www.thinkdeca.com.
About SkyWater Technology
SkyWater (NASDAQ: SKYT) is a U.S.-based semiconductor
manufacturer and a DMEA-accredited Category 1A Trusted Foundry.
SkyWater’s Technology as a Service (TaaS) model streamlines the
path to production for customers with development services, volume
production and heterogeneous integration solutions in its
world-class U.S. facilities. This pioneering model enables
innovators to co-create the next wave of technology with diverse
categories including mixed-signal CMOS, read-out ICs, rad-hard ICs,
power management, MEMS, superconducting ICs, photonics, carbon
nanotubes and interposers. SkyWater serves growing markets
including aerospace & defense, automotive, biomedical, cloud
& computing, consumer, industrial and IoT. For more
information, visit www.skywatertechnology.com/.
SkyWater Technology Forward-Looking Statements
This press release contains “forward-looking” statements within
the meaning of the Private Securities Litigation Reform Act of
1995, including statements that are based on the Company’s current
expectations or forecasts of future events, rather than past events
and outcomes, and such statements are not guarantees of future
performance. Forward-looking statements are subject to risks,
uncertainties, and assumptions, which may cause the Company’s
actual results, performance, or achievements to be materially
different from those expressed or implied by such forward-looking
statements. Key factors that could cause the Company’s actual
results to be different than expected or anticipated include, but
are not limited to, factors discussed in the “Risk Factors” section
of its annual report on Form 10-K and quarterly reports on Form
10-Q, and in other documents that the Company files with the SEC,
which are available at http://www.sec.gov. The Company assumes no
obligation to update any forward-looking statements, which speak
only as of the date of this press release.
SKYT-CORP
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version on businesswire.com: https://www.businesswire.com/news/home/20240110104364/en/
Deca Company Contact: Lori McDonald | 480.236.4236 |
lori.mcdonald@decatechnologies.com Deca Media Contact: Sandy
Fewkes | 408.529.9685 | sfewkes@kiterocket.com SkyWater Company
Contact: Tara Luther | 952.851.5023 |
tara.luther@skywatertechnology.com SkyWater Media Contact:
Lauri Julian | 949.280.5602 |
lauri.julian@skywatertechnology.com
SkyWater Technology (NASDAQ:SKYT)
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