All-new FlexTwin™ and New Generation
SuperBlade® Maximize Compute Density with up to 36,864 Cores per
Rack, featuring Direct to Chip Liquid Cooling and Upgraded
Technologies to Maximize HPC Performance
SAN
JOSE, Calif. and ATLANTA, Nov. 19,
2024 /PRNewswire/ -- Supercomputing Conference
-- Supermicro, Inc. (NASDAQ: SMCI) a Total IT Solution
Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge, is showcasing
its latest high-compute-density multi-node solutions which are
optimized for high intensity HPC workloads. These systems include
the innovative liquid-cooled FlexTwin 2U 4-node purpose-built HPC
architecture and the industry leading SuperBlade with up to 20
nodes in a 6U or an 8U chassis with a range of storage drive
options. Each SuperBlade can accommodate an NVIDIA GPU per node,
accelerating specific applications. Supermicro multi-nodes feature
shared resources to enhance efficiency and reduce raw materials
usage, with significant density improvements compared to standard
rackmount systems.
"Since the release of the industry-first Twin systems back in
2007, Supermicro has consistently been a pioneer in developing the
densest, most efficient multi-node architectures for HPC
workloads," said Charles Liang,
president and CEO of Supermicro. "The new FlexTwin houses either
the Intel Xeon 6 processors with P-cores or the new AMD EPYC 9005
processors, giving customers the choice for their HPC racks scale
deployments. The combination of Supermicro's liquid cooling
experience, extensive multi-node development expertise, rack-scale
integration capacity, and the latest industry technologies enables
us to provide our customers with HPC solutions of unprecedented
performance and scale, helping to solve the world's most complex
computational challenges."
See these new systems and learn more about Supermicro at SC24 by
visiting www.supermicro.com/hpc.
The Supermicro multi-node systems are optimized for HPC
workloads, including financial services, manufacturing, climate
& weather modeling, oil & gas, and scientific research.
Each distinct product family is designed with an optimized
combination of density, performance, and efficiency.
FlexTwin – All-new dual-processor platform designed for
maximum performance density in a liquid-cooled multi-node
architecture, featuring support for the latest CPUs, memory,
storage, and cooling technologies. Purpose-built to support
demanding HPC workloads at scale, including financial services,
manufacturing, scientific research, and complex modeling, FlexTwin
is optimized for performance per dollar. Using a 48U rack as an
example, FlexTwin can support up to 96 dual processor nodes and
36,864 cores within this rack size.
SuperBlade - High-performance, density-optimized,
and energy-efficient architecture with up to 100 servers and 200
GPUs per rack. Direct liquid cooling (DLC) can support servers with
the highest power CPUs to achieve the lowest PUE with the best TCO.
SuperBlade utilizes shared, redundant components, including power
supplies, cooling fans, chassis management modules (CMMs), ethernet
and InfiniBand switches, and pass-thru modules to deliver the most
cost-effective, green computing solutions. Depending on customer
requirements, the flexible SuperBlade is available in either a 6U
or 8U form factor.
BigTwin – The versatile Supermicro BigTwin is available
as a 2U-4Node or 2U-2Node system. The Supermicro BigTwin shares
power supplies and fans, which reduce power consumption. The
BigTwin is available with the Intel Xeon 6 processor.
With its Complete Rack Integration Services, Supermicro works
closely with customers to architect and design rack and entire data
center solutions for HPC workloads. After the design is validated
with customer close involvement, Supermicro offers on-site
deployment services, reducing the time-to-deployment. Supermicro
has a global manufacturing footprint with production facilities in
the USA, Europe, and Asia. It can produce a total of 5,000 racks
per month, including 2,000 liquid-cooled racks, with lead times of
weeks, not months.
Supermicro's multi-node systems feature the latest technologies
to enhance HPC performance.
New-generation processors – Dual Intel® Xeon 6900
series processors with P-cores up to 500W and 128 cores or AMD
EPYC™ 9005 series processors up to 500W and 192 cores are available
in a range of Supermicro HPC servers. In addition, dual Intel Xeon
6700 processors with E-cores up to 330W and 144 cores are also
available in select Supermicro servers.
Higher bandwidth memory - Support for DDR5 up to
6400MT/s improves throughput for memory-intensive and in-memory
computing HPC applications. Systems featuring Intel Xeon 6
processors also support the new MRDIMMs with a bandwidth of up to
8800MT/s.
Direct Liquid Cooling – Supermicro's complete liquid
cooling solutions include CPU and DIMM module cold plates, cooling
distribution manifolds (CDM), in-rack and in-row cooling
distribution units (CDM), connectors, tubing, and cooling towers,
efficiently cooling high-powered CPUs and reducing instances of
thermal throttling. Supermicro has deployed more than 2,000 fully
integrated liquid-cooled racks in the past three months.
EDSFF drives – New support for EDSFF E1.S and E3.S
drives improves storage density and enhances throughput, providing
better storage performance for data-intensive HPC applications.
EDSFF drives also have a more efficient thermal design than
standard storage drives, allowing a higher drive density in
space-constrained multi-node architectures.
Supermicro at Supercomputing Conference 2024
Supermicro will showcase a full AI and HPC infrastructure
solutions portfolio at the Supercomputing Conference, including our
liquid-cooled GPU servers for AI SuperClusters.
Check out the speaking sessions at our in-booth theater, where
customers, experts from Supermicro, and our technology partners
will be presenting on the latest breakthroughs in computing
technology.
Visit Supermicro at booth #2531, Hall B at SC24.
About Super Micro Computer, Inc.
Supermicro (NASDAQ: SMCI) is a global leader in
Application-Optimized Total IT Solutions. Founded and operating in
San Jose, California, Supermicro
is committed to delivering first-to-market innovation for
Enterprise, Cloud, AI, and 5G Telco/Edge IT Infrastructure. We are
a Total IT Solutions manufacturer with server, AI, storage, IoT,
switch systems, software, and support services. Supermicro's
motherboard, power, and chassis design expertise further
enable our development and production, enabling
next-generation innovation from cloud to edge for our global
customers. Our products are designed and manufactured in-house (in
the US, Taiwan, and the Netherlands), leveraging global operations
for scale and efficiency and optimized to improve TCO and reduce
environmental impact (Green Computing). The award-winning portfolio
of Server Building Block Solutions® allows customers to optimize
for their exact workload and application by selecting from a broad
family of systems built from our flexible and reusable building
blocks that support a comprehensive set of form factors,
processors, memory, GPUs, storage, networking, power, and cooling
solutions (air-conditioned, free air cooling or liquid
cooling).
Supermicro, Server Building Block Solutions, and We Keep IT
Green are trademarks and/or registered trademarks of Super Micro
Computer, Inc.
All other brands, names, and trademarks are the property of
their respective owners.
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SOURCE Super Micro Computer, Inc.
