SAN JOSE, Calif., March 28, 2017 /PRNewswire/ -- Ultratech,
Inc. (Nasdaq: UTEK), a leading supplier of lithography, laser
processing and inspection systems used to manufacture semiconductor
devices and high-brightness LEDs (HBLEDs), as well as atomic layer
deposition (ALD) systems, today announced that it has received
follow-on, multiple system orders from several outsourced
semiconductor assembly and test (OSAT) companies in Taiwan, Korea and China. The AP300E lithography stepper will be
used for leading-edge copper pillar and wafer-level packaging (WLP)
in high-volume manufacturing (HVM). Ultratech plans to begin
shipping the systems in Q2 and Q3 of this year.
Ultratech General Manager and Vice President of Lithography
Products Rezwan Lateef stated,
"OSATs are rapidly expanding their advanced packaging capabilities
to capture the strong demand for copper pillar and fan-out package
solutions. These customers look to their equipment suppliers to
provide highly reliable, flexible, extendible and cost-effective
solutions coupled with excellent application-specific knowledge.
The AP300E lithography stepper delivers on all these aspects
coupled with outstanding regional support. Ultratech believes that
success in the OSAT market requires local, on-site support and has
greatly expanded its presence (both in personnel and
infrastructure) in the Asia
Pacific region with a focus on Taiwan, China
and Korea. These repeat, multiple system orders across the broad
OSAT spectrum are a clear validation of our market leadership
position and a strong statement of continued partnership from our
customers. We look forward to working with these valued
customers to meet their current production needs and to develop the
applications of tomorrow."
Ultratech's AP300 Family of Lithography Steppers
The
AP300 family of lithography systems is built on Ultratech's
customizable Unity Platform™, delivering superior
overlay, resolution and side wall profile performance and enabling
highly-automated and cost- effective manufacturing. These systems
are particularly well suited for copper pillar, fan-out,
through-silicon via (TSV) and silicon interposer applications. In
addition, the platform has numerous application-specific product
features to enable next-generation packaging techniques, such as
Ultratech's award winning dual-side alignment (DSA) system,
utilized around the world in volume production.
Safe Harbor
This release includes forward looking
statements within the meaning of the Private Securities Litigation
Reform Act of 1995. Forward looking statements can generally be
identified by words such as "anticipates," "expects," "remains,"
"thinks," "intends," "believes," "estimates," and similar
expressions and include management's current expectation of its
longer term prospects for success. These forward looking
statements are based on our current expectations, estimates,
assumptions and projections about our business and industry, and
the markets and customers we serve, and they are subject to
numerous risks and uncertainties that may cause these forward
looking statements to be inaccurate. Such risks and uncertainties
include the timing and possible delays, deferrals and cancellations
of orders by customers; quarterly revenue fluctuations; industry
and sector cyclicality, instability and unpredictability; market
demand for consumer devices utilizing semiconductors produced by
our clients; our ability to manage costs; new product
introductions, market acceptance of new products and enhanced
versions of our existing products; reliability and technical
acceptance of our products; our lengthy sales cycles, and the
timing of system installations and acceptances; lengthy and costly
development cycles for laser processing and lithography
technologies and applications; competition and consolidation in the
markets we serve; improvements, including in cost and technical
features, of competitors' products; rapid technological change;
pricing pressures and product discounts; our ability to collect
receivables; customer and product concentration and lack of product
revenue diversification; inventory obsolescence; general economic,
financial market and political conditions and other factors outside
of our control; domestic and international tax policies;
cybersecurity threats in the United
States and globally that could impact our industry,
customers, and technologies; and other factors described in our SEC
reports including our Annual Report on Form 10K filed for the year
ended December 31, 2016. Due to these
and other factors, the statements, historical results and
percentage relationships set forth herein are not necessarily
indicative of the results of operations for any future period. We
undertake no obligation to revise or update any forward looking
statements to reflect any event or circumstance that may arise
after the date of this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs,
builds and markets manufacturing systems for the global technology
industry. Founded in 1979, Ultratech serves three core markets:
frontend semiconductor, backend semiconductor, and
nanotechnology. The company is the leading supplier of lithography
products for bump packaging of integrated circuits and high
brightness LEDs. Ultratech is also the market leader and pioneer of
laser spike anneal technology for the production of advanced
semiconductor devices. In addition, the company offers solutions
leveraging its proprietary coherent gradient sensing (CGS)
technology to the semiconductor wafer inspection market and
provides atomic layer deposition (ALD) tools to leading research
organizations, including academic and industrial institutions.
Visit Ultratech online at: www.ultratech.com.
(UTEKG)
Unity Platform is a trademark of Ultratech, Inc.
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SOURCE Ultratech, Inc.