BOULDER,
Colo., Feb. 3, 2025 /PRNewswire/ --
Acroname, a Valens Semiconductor company, today
announced that it has launched a new product, the USBExt3c, a
3-port switchable hub with dedicated point-to-point
USB3 and USB2 extension, combined with advanced PoE
and USB-C power delivery. The product
allows AV installers and OEM product manufacturers to
control, manage and extend USB devices, streamlining
product deployment for industries such as machine vision,
corporate, and education.
Leveraging both Valens' HDBaseT and Acroname's BrainStem
technologies, the USB3Ext3c addresses the challenge of power
delivery and negotiation in USB-extended systems. It allows users
to manage an array of USB-based peripheral devices, extending past
the short cable limitations of USB2 and USB3, without worrying
about power negotiation. This is a significant benefit specifically
for high-bandwidth devices, such as high-end cameras, storage
devices, and devices requiring high-power charging (e.g.,
laptops).
The new product is based on Acroname's system automation control
platform, BrainStem, which provides highly modular and scalable
hardware and software tools, including tools for management of USB
and USB-PD, used in OEM applications around the world. The product
also leverages the Valens VS6320 chipset, the first
ASIC-based high-performance extension solution for
USB3.2.
"This product launch represents a significant step forward in
making USB a professional-grade technology," said Justin Gregg, CEO of Acroname. "It enables our
customers to achieve unprecedented reliability in their USB
connections for robust and flexible system design."
"This exciting product is the result of significant synergies
between our two companies and is precisely what we envisioned when
we acquired Acroname," said Gili
Friedman, Head of the Cross-Industry Business Unit at Valens
Semiconductor. "By combining the robust HDBaseT standard with
Acroname's BrainStem technology, Acroname is delivering
cutting-edge solutions that push the boundaries of USB extension
and power delivery."
The USBExt3c will be officially unveiled at Integrated Systems
Europe (ISE) 2025 from Feb 4, 2025 –
Feb 7, 2025, and will be on display
at the HDBaseT Alliance booth #2M500. In addition, Acroname will
also be demonstrating other robust USB solutions that maximize
system visibility, which are compatible with AVI-SPL's Symphony
platform and Sennheiser's TeamConnect Bar products.
See the product page for photos and more information.
Contact Lance Davies for more
information or interviews: lance@acroname.com
About Valens Semiconductor
Valens Semiconductor (NYSE: VLN) is a leader in high-performance
connectivity, enabling customers to transform the digital
experiences of people worldwide. Valens' chipsets are integrated
into countless devices from leading customers, powering
state-of-the-art audio-video installations, next-generation
videoconferencing, and enabling the evolution of ADAS and
autonomous driving. Pushing the boundaries of connectivity, Valens
sets the standard everywhere it operates, and its technology forms
the basis for the leading industry standards such as HDBaseT® and
MIPI A-PHY.
For more information, visit https://www.valens.com/.
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SOURCE Acroname