New Flex solutions enable cloud service
providers to address power, heat, and scale challenges in the AI
era
News summary
- Flex launches new compute, rack, and intermediate bus converter
products for AI data centers
- Flex and JetCool® partner for direct-to-chip liquid
cooling
- Flex's ORv3-compatible rack integrated with single-phase liquid
cooling, enabled for two-phase liquid cooling
SAN
JOSE, Calif., Oct. 14,
2024 /PRNewswire/ -- OCP Global Summit --
Flex (NASDAQ: FLEX) today announced new reference platforms for
liquid-cooled servers, rack, and power products that will enable
customers to sustainably accelerate data center growth. These
innovations build on Flex's ability to address technical challenges
associated with power, heat generation, and scale to support
artificial intelligence (AI) and high-performance computing (HPC)
workloads.
"Flex delivers integrated data center IT and power
infrastructure solutions that address the growing power and compute
demands in the AI era," said Michael
Hartung, president and chief commercial officer, Flex. "We
are expanding our unique portfolio of advanced manufacturing
capabilities, innovative products, and lifecycle services, enabling
customers to deploy IT and power infrastructure at scale and drive
AI data center expansion."
Flex is highlighting these new capabilities this week for the
data center community during the OCP Global Summit in San Jose, California. Attendees may visit
booth A11 for demonstrations.
Liquid-cooled servers and racks for AI
workloads
Flex announced customizable, open
standard-based, compute reference designs integrating
JetCool's SmartPlate™
direct-to-chip liquid cooling solution.
JetCool's patented
microconvective cooling® technology extends the
value of single-phase, direct-to-chip liquid cooling deployments
because it cools over 1,500W per socket, more than enough headroom
to accommodate the most advanced AI servers.
JetCool and Flex separately announced a
partnership to deliver liquid-cooled solutions at scale.
The Flex platform design is based on a next-generation modular
compute platform supporting the Host Processor Module (HPM)
customized to meet the unique requirements of different AI and HPC
applications. This modular compute platform includes a new HPM that
supports up to two Intel® Xeon® 6900 series with P-cores, the
latest generation of data center processors from Intel. The
platform also integrates the Flex Secure Control Module (SCM)
2.0, which is the next generation of the Flex SCM that delivers
server management, security, and control functions in a common form
factor. The platform complies with the OCP DC-MHS 2.0 and OCP
DC-SCM 2.0 specifications and is deployable in racks compliant with
the Open Rack V3 (ORv3) specification.
The Flex Open Rack V3 solution is both compatible with ORv3
specification and customizable to support 21" and 19" footprints
for IT equipment, accommodating any rack configuration including
liquid cooling. Flex is currently in volume production with leading
hyperscalers delivering customized, ORv3-based rack designs at
scale. Flex also manufactures ORv3-compliant power shelves, power
supplies, and busbars as standalone products or as part of a
vertically integrated solution.
New power modules expand offering
Flex Power Modules
launched new Intermediate Bus Converters (IBC) designed
to meet the needs of data centers powering AI, machine learning,
and cloud applications. The new products expand the breadth of Flex
Power Modules offerings for digital, non-isolated, unregulated
IBCs.
Data center manufacturing capabilities, products, and
services at scale
Flex delivers advanced manufacturing, data
center IT and power infrastructure solutions from the grid to the
chip, and product lifecycle services to address industry-wide
challenges with power, heat, and scale. The company's cloud-focused
manufacturing services span the value chain to support the mass
deployment of vertically integrated data center racks from sourcing
of materials and private-label components to the design,
manufacturing, fulfillment and sustainable maintenance of servers,
storage, racks, cabling, switches, bus bars, power shelves, and
battery back-up, coupled with liquid cooling technologies. Flex
power products enable data center operators to more efficiently
manage power through innovative critical power infrastructure, such
as switchgear and power distribution units, and embedded power at
the server- and rack-levels, such as power modules and power
shelves.
About Flex
Flex (Reg. No. 199002645H) is the
manufacturing partner of choice that helps a diverse customer base
design and build products that improve the world. Through the
collective strength of a global workforce across 30 countries and
responsible, sustainable operations, Flex delivers technology
innovation, supply chain, and manufacturing solutions to diverse
industries and end markets.
Flex Contacts
Investors & Analysts
David A. Rubin
Vice President, Investor Relations
(408) 577-4632
David.Rubin@flex.com
Media & Press
Michelle Kershner
Director, Commercial Integrated Marketing and Communications
(602) 421-6407
michelle.kershner@flex.com
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SOURCE Flex